“Atomic-Scale Material Removal Mechanisms in CeO₂-Based Chemical Mechanical Polishing of 4H-SiC”. Journal of Advanced Thermal and Fluid Systems in Aerospace 1 (December 26, 2025): 51–61. Accessed March 7, 2026. https://www.thermalfluidaerospace.com/index.php/JATFSA/article/view/4.